Power chips are connected to exterior circuits via packaging, and their efficiency depends on the assistance of the packaging. In high-power situations, power chips are generally packaged as power components. Chip interconnection describes the electrical connection on the top surface of the chip, which is typically aluminum bonding cable in conventional modules. ^
Standard power component bundle cross-section
Today, industrial silicon carbide power modules still mainly make use of the packaging innovation of this wire-bonded standard silicon IGBT component. They face issues such as large high-frequency parasitical parameters, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The display of superb performance. In order to address these troubles and totally make use of the big possible advantages of silicon carbide chips, lots of brand-new product packaging innovations and options for silicon carbide power components have actually emerged in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold wire bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold wires to copper cables, and the driving pressure is price decrease; high-power tools have created from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item performance. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with typical bonding product packaging techniques, Cu Clip innovation has the following benefits:
1. The connection in between the chip and the pins is made of copper sheets, which, to a specific level, changes the conventional wire bonding approach in between the chip and the pins. Therefore, an one-of-a-kind bundle resistance worth, greater current flow, and much better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can completely save the price of silver plating and poor silver plating.
3. The product look is entirely regular with typical items and is primarily made use of in servers, mobile computers, batteries/drives, graphics cards, motors, power supplies, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding approach is more expensive and intricate, yet it can accomplish much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The resource pad utilizes a Clip method, and the Gate makes use of a Cable approach. This bonding method is slightly less costly than the all-copper bonding technique, conserving wafer location (appropriate to really little entrance locations). The process is less complex than the all-copper bonding method and can acquire far better Rdson and far better thermal effect.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper flashing roll, please feel free to contact us and send an inquiry.
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